Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Fri Mar 31 15:58:07 EDT 2017 | jutikagokarn
Thank you for your response. We build boards on an SMT line that is shared with other companies too and are currently using water soluble flux based solder paste on both boards. We realized an issue with washing on one of the boards so requested to
Electronics Forum | Fri Mar 31 11:56:36 EDT 2017 | jutikagokarn
We are trying to build two different PCBs - one with no wash flux solder paste and the other with a washable flux solder paste. How difficult is it to use the same SMT line and switch between the two pastes? I assume there will be some cleaning invol
Electronics Forum | Fri Mar 31 13:59:21 EDT 2017 | westshoredesign
Need more information. BUT if your strictly considering just the paste change. I would imagine your changeover would be little to no different than changing to the second board if you were using the same paste. Maybe take extra care cleaning your sq
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Fri Dec 08 11:30:19 EST 2006 | ganoi
We discussed about applying 2 dots of glue on either sides of the LED body, but have yet to try it out. Other discussions include conductive adhesive, using fixturing with weight, different stencil aperature design, hand soldering.
Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi
Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu
Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton
I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
